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Infineon and Siemens collaborate for innovation

By Karen Chow When Infineon needed to select a field solver for the development of their next-generation power semiconductor products,…

mPower power integrity analysis solution recognized for innovation and market impact

By Joe Davis Sponsored by France’s ElectroniqueS magazine, the Electrons d’Or Award program identifies the most innovative products of the…

Struggling to verify the reliability of your multiple-power-domain designs?

By Hossam Sarhan With the growing complexity of system-on-chip designs and technology scaling, multiple power domains are needed to optimize…

TSMC OIP Ecosystem Forum 2022 all wrapped up, but not gone yet…

By Calibre Design Staff 1500+ attendees! 50 technical papers (30 live, 20 online) in three separate tracks! Standing room only…

Efinix Titanium FPGAs depend on mPower power integrity analysis

By John Wagnon Efinix’s high-performance Titanium FPGAs are custom-tailored for the computing demands of mainstream applications, targeting markets from intelligent…

Plug and Play ESD protection

By Mark Tawfik Electrostatic discharge (ESD) is the discharge of static electrical current when two objects come into contact. One…

AUA announces extension of collaboration with Siemens for advanced research and academic enhancement

Back in 2012, the American University of Armenia (AUA) initiated a collaborative relationship with electronic design automation (EDA) leader Mentor…

Google, AMD, and Siemens EDA walk into a cloud…

By Michael White At DAC this past July, I had the opportunity to sit down with Phil Steinke from AMD…

What’s an ESD design window, and why do I care?

By Derong Yan As we move to advanced semiconductor process nodes, electrostatic discharge (ESD) issues have become more critical in…