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Driving 3D IC innovation with Calibre multiphysics: A holistic approach for next-generation design

By John Ferguson Fun fact: The concept of 3D integrated circuits (3D ICs) has been around since shortly after the…

Siemens-imec collaboration reduces stochastic failures in EUV lithography by orders of magnitude in wafer-level experimental validation

Siemens stochastic-aware OPC reduces EUV stochastic failures at wafer level for SRAM and logic, validating predictive modeling with experimental data.

Enhancing IC Verification: Smarter solutions for faster, more reliable designs

By Jonathan Muirhead Modern chip layouts are more intricate than ever, incorporating a mix of custom and third-party intellectual property…

Revolutionizing 3D IC design with integrated multiphysics verification

By Yoyo Li The semiconductor landscape is always evolving—sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress…

How to boost reliability with early-stage reliability checks

By Chun-hsiang Chang The rapid expansion of AI-powered consumer electronics is pushing IC manufacturing to the sub-2 nm frontier. To…

Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints…

Ensure power domain compatibility by finding missing level shifters with Insight Analyzer

By Bhanu Pandey Level shifters are essential for safe, reliable mixed-signal IC design—especially as designers deploy more power domains than…

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…

Calibre Vision AI: a new era of fast, scalable chip-level DRC debug

By James Paris As chip designs grow more complex and SoCs reach new heights in size and integration, the challenges…