Xpedition

Schematic Capture Enhancements in Xpedition® – VX.2.7

April 21, 2020

The latest release of Xpedition® VX.2.7  is enhanced with many new Schematic Capture features that…

By John McMillan
2 MIN READ
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What’s New in Xpedition® IC Packaging Design for VX 2.7

April 3, 2020

Mentor’s Xpedition® IC Packaging design tools bridge the gap between engineering teams for IC layout,…

By John McMillan
1 MIN READ
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Remote Working Resources for Mentor PCB Customers

March 26, 2020

Late last week you may have seen the open letter  from our CEO, Tony Hemmelgarn,…

By A.J. Incorvaia
2 MIN READ
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What’s New in HyperLynx® VX 2.7

March 24, 2020

HyperLynx is industry-renowned for ease of use, with automated workflows that make sophisticated analysis accessible…

By John McMillan
1 MIN READ
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Going to DAC’2017 in Austin TX? Interested in High Density Advanced Packaging? then read on!!

May 26, 2017

If you’re coming or planning on coming to DAC this June and interested in HDAP…

By Keith Felton
1 MIN READ
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