Breaking the Bottleneck: A Smarter Approach to Semiconductor Verification
The semiconductor industry is facing a new reality: traditional verification methods can no longer keep pace with the rapid evolution of design complexity. Chiplet-based architectures, 3DICs, and software-defined functionality are pushing verification teams to their limits, amplifying delays, costs, and risk.
Enter the Verification Productivity Gap 2.0—a challenge that demands a new, connected, and intelligent approach.
My latest Siemens EDA white paper, Breaking the Bottleneck: Overcoming the Verification Productivity Gap 2.0, explores how AI-driven, data-centric, and scalable verification solutions can transform the way teams manage complexity. By integrating predictive analytics, automation, and cross-domain intelligence, engineering teams can accelerate verification cycles, reduce defect escapes, and optimize resources in a way that was never before possible.
The data speaks for itself—ASIC first-silicon success rates have hit record lows, and verification bottlenecks are now a primary source of product delays. Without a fundamental shift, companies risk falling behind in an increasingly competitive landscape.
What’s the path forward? Download the white paper to explore Siemens’ vision for the future of verification and how connected intelligence is redefining productivity in semiconductor design.
