Breaking down 50 million pins: A smarter way to design 3D IC packages​

As 3D IC complexity skyrockets, are we truly evolving our design methodologies at the same pace, or are we unknowingly…

Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation…

How to Design Smarter: System-level multiphysics in 3D integration​

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple…

ic package type

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

​Why 3D ICs need a mindset shift and how to make it happen

What if the most revolutionary advances in semiconductor design aren’t about making things smaller, but about fundamentally reimagining how we…

Multiphysics analysis heterogeneous chiplet integration

Mastering interface planning and predictive analysis in IC design

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and…

​The hidden heat challenge of 3D ICs:  And what designers need to know

Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across…

3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

​Why Traditional PCB Methods Fall Short in 3D IC Design

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…