Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…
In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…
If you’re involved in semiconductor package design using routable substrates — that is, as opposed to leadframe based — then…
As consumer electronic devices grow increasingly connected, intelligent and advanced, designers need new methodologies such as 3D IC to address…
