Xpedition IC Packaging - Semiconductor Packaging

User2User 2024: Chiplets for future automotive application: Fraunhofer

September 11, 2024

Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.

By John McMillan

3 MIN READ

The evolution of machine learning (ML) in the physical design and verification of semiconductor packages

August 14, 2024

Discover how Siemens’ EDA evolution of machine learning in the physical design and verification of semiconductor packages.

By John McMillan

2 MIN READ

User2User 2024: EMIB based advanced packaging flow – Intel Foundry

August 12, 2024

Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.

By John McMillan

3 MIN READ

Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

August 8, 2024

Explore this infographic to learn why a comprehensive workflow essential for chiplet design and today’s 3D IC architectures.

By John McMillan

2 MIN READ

The multi-physics challenge: Known good die may not behave in 3D IC as stand alone!

August 5, 2024

Discover how Siemens’ EDA tackles the multi-physics challenge to achieve fast, accurate assembly-level physical verification.

By John McMillan

2 MIN READ

Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

July 31, 2024

Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

By John McMillan

4 MIN READ

The role of AI-infused EDA solutions for semiconductor-enabled products and systems

July 23, 2024

Discover why semiconductor-enabled products and systems are demanding AI-infused solutions and how AI is changing the nature of semiconductor design.

By John McMillan

2 MIN READ

Image showing physical design IP reuse with Xpedition Package designer

Embracing physical design IP reuse as a best practice

July 22, 2024

Efficiency in IC package design is becoming more important as design cycles shorten and complexity surges. One common approach to…

By Keith Felton

2 MIN READ

Discover how AI is changing the nature of semiconductor design

July 16, 2024

AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating…

By John McMillan

2 MIN READ