Semiconductor Packaging

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Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Featured posts

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan
14 MIN READ
Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton
2 MIN READ
Text that says what's new in IC Packaging 2409 next to a stylized X

What’s new in IC Packaging 2409

September 19, 2024

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

By Keith Felton
3 MIN READ

Latest posts

ic package type

Ultimate guide to IC package types: choose the right package technology

July 28, 2025

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

By John McMillan
6 MIN READ

​Why 3D ICs need a mindset shift and how to make it happen

July 17, 2025

What if the most revolutionary advances in semiconductor design aren’t about making things smaller, but about fundamentally reimagining how we…

By John McMillan
17 MIN READ
Multiphysics analysis heterogeneous chiplet integration

Mastering interface planning and predictive analysis in IC design

July 16, 2025

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and…

By Tova Levy
2 MIN READ

​The hidden heat challenge of 3D ICs:  And what designers need to know

July 8, 2025

Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across…

By John McMillan
12 MIN READ
3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

By John McMillan
6 MIN READ

​Why Traditional PCB Methods Fall Short in 3D IC Design

June 16, 2025

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…

By John McMillan
11 MIN READ
3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

June 5, 2025

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

By John McMillan
6 MIN READ

​3D IC technology trends: Microarchitecture in IC design

June 3, 2025

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in…

By John McMillan
11 MIN READ
Subscribe to the Siemens 3D IC podcast

🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

June 3, 2025

Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the…

By John McMillan
2 MIN READ