Semiconductor Packaging

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Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

Learn more about semiconductor packaging design and verification.

Featured posts

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan
14 MIN READ
Screen shots of Innovator3D IC software in use.

Exploring TSMC InFO_oS and InFO_PoP certification

February 28, 2025

Siemens EDA has recently achieved this certification for Xpedition Package Designer as part of the TSMC InFO_oS and InFO_PoP workflows.

By Keith Felton
2 MIN READ
Text that says what's new in IC Packaging 2409 next to a stylized X

What’s new in IC Packaging 2409

September 19, 2024

The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for…

By Keith Felton
3 MIN READ

Latest posts

Why every 3D IC needs a test vehicle before it hits production​

September 22, 2025

Would you risk millions of dollars on a semiconductor design without knowing if it can be manufactured? Discover why test…

By John McMillan
13 MIN READ

Breaking down 50 million pins: A smarter way to design 3D IC packages​

September 3, 2025

As 3D IC complexity skyrockets, are we truly evolving our design methodologies at the same pace, or are we unknowingly…

By John McMillan
8 MIN READ

Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

August 19, 2025

Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation…

By John McMillan
11 MIN READ
Illustrative example of 3D IC heat dissipation - thermal management

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With…

By John McMillan
6 MIN READ
3D IC Stackup in Innovator3D IC

The Missing Piece for Chiplet Success

August 11, 2025

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,…

By Tova Levy
2 MIN READ

How to Design Smarter: System-level multiphysics in 3D integration​

August 7, 2025

What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple…

By John McMillan
12 MIN READ
ic package type

Ultimate guide to IC package types: choose the right package technology

July 28, 2025

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

By John McMillan
6 MIN READ

​Why 3D ICs need a mindset shift and how to make it happen

July 17, 2025

What if the most revolutionary advances in semiconductor design aren’t about making things smaller, but about fundamentally reimagining how we…

By John McMillan
17 MIN READ
Multiphysics analysis heterogeneous chiplet integration

Mastering interface planning and predictive analysis in IC design

July 16, 2025

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and…

By Tova Levy
2 MIN READ