Co-packaged optics chip

Five Key Trends of Co-Packaged Optics (CPO) in 2026

For years, data-center performance scaled by following a familiar playbook: faster GPUs, higher SerDes rates, and increasingly aggressive board designs….

Six IC packaging trends

Six Key Trends Redefining 3D IC Packaging in the AI Era

Some say we are officially in the Post-Moore’s Law world.  Moore himself closed his seminal paper by mentioning the “day…

AI in 3D IC design

AI is reshaping the 3D IC design ecosystem: Key trends to watch in 2026

Headlines on how the global AI race leads to the shortages of GPUs in no short supply. Behind those headlines…

3D IC thermal challenges and trends 2026

Key Thermal Advances Driving Next-Gen AI Chip Design in 2026

AI is hot — literally.  As we bid farewell to a transformative year of 2025, there’s no doubt that the AI chip underwent substantial changes. As AI compute is pushing…

10 steps for successful heterogeneous chiplet integration

Unlock advanced chiplet design success: Discover the Siemens EDA Heterogeneous Integration eBook series

The future of semiconductor innovation is rapidly shifting from monolithic chips to advanced, multi-chiplet architectures. As devices demand greater power,…

3D IC Stackup in Innovator3D IC

The Missing Piece for Chiplet Success

Chiplets are revolutionizing the semiconductor industry, enabling unprecedented levels of integration, performance, and flexibility. By breaking complex designs into smaller,…

ic package type

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

Multiphysics analysis heterogeneous chiplet integration

Mastering interface planning and predictive analysis in IC design

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and…

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…