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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Electronic Systems Design

What’s new in HyperLynx 2409

September 19, 2024
HyperLynx is expanding beyond high-speed design to provide simulation and analysis for all stages of PCB design and verification. HyperLynx...
By Todd Westerhoff
4 MIN READ

Semiconductor Packaging

What’s new in IC Packaging 2409

September 19, 2024
The 2409 release is a landmark update in the field of electronic design automation (EDA), introducing a next-generation solution for...
By Keith Felton
3 MIN READ

Semiconductor Packaging

Join us at the TSMC 2024 NA OIP Ecosystem Forum

September 18, 2024
The TSMC 2024 North America OIP (Open Innovation Platform®) Ecosystem Forum is just around the corner, and Siemens EDA is...
By Keith Felton
3 MIN READ

Calibre IC Design & Manufacturing

Optimal ESD protection with Calibre PERC and Solido Simulation Suite

September 17, 2024
By Neel Natekar Integrated circuit (IC) reliability engineers face the dual challenge of ensuring robust electrostatic discharge (ESD) protection without...
By Calibre IC Design & Manufacturing
4 MIN READ

Semiconductor Packaging

User2User 2024: Silicon photonics to integrate chiplets: Swissbit

September 17, 2024
Swissbit is pioneering chiplet and system-on-package solutions that embed security and functional safety from the design phase to meet stringent requirements in harsh industrial and automotive environments.
By John McMillan
3 MIN READ

Cre8Ventures (Siemens EDA)

University of Southampton ECS - Siemens Cre8venture Centre: Driving Innovation in Semiconductor Technology

September 17, 2024
Introduction The rapidly evolving landscape of semiconductor technology necessitates a new breed of partnerships between academia and industry to drive...
By Carson Bradbury
3 MIN READ

Custom IC

Redefining High-Sigma Verification: Reflections on Presenting AI-Powered Methodologies at DAC 2024

September 12, 2024
This year, I had the privilege of presenting at the 2024 Design Automation Conference (DAC), which took place in San...
By Mohamed Atoua
< 1 MIN READ

EDA Support Blogs

Optimizing DFT efficiency: Essential guidelines for SSN Bus Width and EDT channels

September 12, 2024
For an SSN design, only the SSN bus data in, SSN bus data out, SSN bus clock, and the TAP...
By Linus Tauro
< 1 MIN READ

Semiconductor Packaging

User2User 2024: Chiplets for future automotive application: Fraunhofer

September 11, 2024
Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.
By John McMillan
3 MIN READ

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