By John Ferguson and Kevin Rinebold Deca Technologies’ Adaptive Patterning technology and their newly-announced adaptive patterning design kit (APDK) have…
By John Ferguson, Mentor Graphics FOWLP design popularity is driving foundries to develop in-house FOWLP flows. How will that affect…
By John Ferguson, Mentor Graphics FO-WLP combines multiple die from heterogeneous processes into a compact package, and that’s a good…
By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?
