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ic package

IC package designers—looking for multi-die, system-level signoff verification?

February 16, 2022

By Shelly Stalnaker Ever tried a food sample when you were shopping…not just because it’s free food (!), but because…

By Design With Calibre
2 MIN READ

Efficient package delivery is not just for FedEx!

July 12, 2021

By John Ferguson Cost, risk, and the limitations of monolithic scaling are driving growth in multi-die (heterogeneous) advanced IC packaging…

By Design With Calibre
1 MIN READ

Adaptive Patterning: Moving with the times (and technologies)

March 24, 2021

By John Ferguson and Kevin Rinebold Deca Technologies’ Adaptive Patterning technology and their newly-announced adaptive patterning design kit (APDK) have…

By Design With Calibre
2 MIN READ
Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

December 1, 2015

By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?

By Design With Calibre
4 MIN READ