By Shelly Stalnaker Ever tried a food sample when you were shopping…not just because it’s free food (!), but because…
By John Ferguson Cost, risk, and the limitations of monolithic scaling are driving growth in multi-die (heterogeneous) advanced IC packaging…
By John Ferguson and Kevin Rinebold Deca Technologies’ Adaptive Patterning technology and their newly-announced adaptive patterning design kit (APDK) have…
By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?
