Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software…

Shift left in IC design: A holistic strategy for faster, smarter verification

By Michael White and David Abercrombie As IC design complexity continues to grow, companies are turning to the shift left…

Enhanced short isolation process for faster circuit verification

By Ritu Walia Repetitive layout vs. schematic (LVS) runs can significantly delay project timelines. A huge number of shorted nets…

Unveiling the future of 3DIC design with Calibre 3DThermal

By Lee Wang The semiconductor industry is undergoing a transformative shift from traditional 2D integrated circuit (IC) designs to more…

Optimal ESD protection with Calibre PERC and Solido Simulation Suite

By Neel Natekar Integrated circuit (IC) reliability engineers face the dual challenge of ensuring robust electrostatic discharge (ESD) protection without…

Cracking the code: ensuring reliability and performance in IC design with EM/IR analysis

By Karen Chow and Joel Mercier Integrated circuits (ICs) are everywhere, powering everything from washing machines and TVs to medical…

Speeding up early design rule checking with Calibre nmDRC Recon

By John Ferguson and Nermeen Hossam Chip designers are very aware of how time-consuming early design rule checking (DRC) can…

Automated analysis-based layout enhancements reduce power grid voltage drops during place & route: A case study with Google

By Jeff Wilson Power isn’t just a small factor in the IC design arena—it’s a cornerstone. Design teams work to…

Accelerate IP design cycles and reduce costs with Calibre design stage verification

By Terry Meeks In the fast-paced world of semiconductor design, time is a critical asset. One way IC designers save…