3D-IC

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In the EDA world, efficiency + ease of use = productivity (and profitability!)

October 21, 2021

By Shelly Stalnaker Electronic design automation (EDA) grew out of the need to make it easier and faster to design…

By Design With Calibre
2 MIN READ

2.5/3D IC designers! Don’t get hung up on latch-up!

July 27, 2021

By Dina Medhat Latch-up is modeled as a short circuit (low-impedance path) that occurs in an integrated circuit (IC). It…

By Design With Calibre
2 MIN READ

Automated ESD protection verification for 2.5-3D ICs is now a reality

January 28, 2021

Got the mid-winter blahs? The post-New Year letdown? Looking for something to rev you up? How about an automated method…

By Design With Calibre
2 MIN READ
More Than Moore: Finally Crossing the Chasm?

More Than Moore: Finally Crossing the Chasm?

February 15, 2016

By Michael White, Mentor Graphics Will fan-out wafer-level packaging be the impetus that pushes 3D-IC into mainstream acceptance?  

By Design With Calibre
6 MIN READ
Why Do We Need Assembly Design Kits for Packages?

Why Do We Need Assembly Design Kits for Packages?

December 1, 2015

By John Ferguson and Tarek Ramadan, Mentor Graphics Why do we need assembly design kits for IC packages?

By Design With Calibre
4 MIN READ