Featured Posts

Latest Posts

What’s New in Xpedition IC Packaging-VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package…

TESAT: Launching high-density space designs better and faster with stellar collaboration tools

Have you ever wondered how a global, industry-leading company is able to design the most complex equipment for communication satellites…

Xpedition® VX.2.11 is now available for download!

Xpedition® Enterprise is the industry’s most innovative PCB design flow, providing integration from system design definition to manufacturing execution. Its…

New 3D IC Podcast Launch

NEW PODCAST – We’re excited to announce the launch of our new podcast dedicated to 3D IC! Join me as…

3D IC takes a village but must start with a netlist

In today’s 3D IC designs, accurately capturing the complete design intent (i.e., the connectivity) of dies, silicon interposers, organic substrates…

Stoneridge: Addressing Digital Transformation with Xpedition Enterprise

Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…

TLA winner for Transportation & Automotive

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Telecom, Network Controllers, Line Cards

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…