From manageability to 3.0: Unlocking the future with UCIe verification

The semiconductor industry is steadily moving toward multi-die integration, where chiplets from different sources are combined within a single package (known as a system in package or SiP) to deliver higher performance, scalability, and efficiency. The Universal Chiplet Interconnect Express (UCIe) standard is the backbone of this movement, offering a high-bandwidth, low-latency interconnect that enables heterogeneous chiplets to operate as one system.

UCIe 3.0 raises the bar once again. By adding higher data rates, runtime recalibration, priority sideband messaging, low-power sideband operation, and circular buffer transport, the standard improves both performance and efficiency. But it also increases verification complexity.