Video: Testonica uses Tessent IJTAG to implement an FPGA-based reference system

Learn how Testonica used Tessent to implement an FPGA-based reference system for pre-silicon evaluation and validation of a target IJTAG infrastructure. This video was recorded at the 2023 European User2User conference.

Video: NXP Semiconductors success with Tessent for in-system test for ISO 26262

Learn how NXP Semiconductors implemented in-system test for automotive devices using Tessent, recorded at the 2023 European User2User conference.

Video: Intel uses Tessent SSN for IC test and bring-up

Hear about Intel’s use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.

The future of in-system testing for automotive safety

Suppliers of IP for automotive applications must ensure their IP blocks are ISO 26262 compliant. Siemens has the solutions for automotive safety and reliability.

On-demand Webinar: Faster DFT, better results

Learn about faster DFT and better results using the bus-based packetized test of Tessent Streaming Scan Network.

Event: Tessent 2023 DFT Tech Forum

Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.

Tessent at ISTFA 2022

Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.

Efficient and effective DFT for 3D stacked die

Yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs.

Typical allocation of functional safety within an automotive SoC.

Webinar: Meet the Challenges of ISO 26262 with Tessent Test Solutions

Register Now! Tune in on June 9, 2022 at 11:00 am (pacific daylight time) to learn how to use Tessent…