The day has already arrived when we need to be concerned about the cybersecurity of our cars. A multi-layers approach to secure semiconductors builds security in from the start.
Tessent software and IP ensures semiconductor companies can achieve the highest IC quality. Learn how.
Learn how to use Tessent test solutions for functional safety and automotive applications. This video was recorded at the 2023 Design Automation Conference.
Learn how Tessent Multi-die software helps implement design-for-test structures for 2.5D and 3D designs. This video was recorded at the 2023 Design Automation Conference.
Learn how STMicroelectronics used Tessent defect-oriented test to improve the quality of devices for their automotive customers. This video was recorded at the 2023 European User2User conference.
Learn how Qualcomm reduced test pattern count using Tessent testpoint technology. This video was recorded at the 2023 European User2User conference.
Learn how Testonica used Tessent to implement an FPGA-based reference system for pre-silicon evaluation and validation of a target IJTAG infrastructure. This video was recorded at the 2023 European User2User conference.
Learn how NXP Semiconductors implemented in-system test for automotive devices using Tessent, recorded at the 2023 European User2User conference.
Hear about Intel’s use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.
