Technology advancements have led to a significant increase in system-on-chip (SoC) complexity, necessitating the careful optimization of DFT techniques to…
Learn how to ensure safety for automotive ICs with Tessent solutions from Siemens EDA.
Learn how artificial intelligence (AI) is advancing IC test and yield analysis.
Advanced EDA technology eases AI chip development.
The day has already arrived when we need to be concerned about the cybersecurity of our cars. A multi-layers approach to secure semiconductors builds security in from the start.
Tessent software and IP ensures semiconductor companies can achieve the highest IC quality. Learn how.
Learn how to use Tessent test solutions for functional safety and automotive applications. This video was recorded at the 2023 Design Automation Conference.
Learn how Tessent Multi-die software helps implement design-for-test structures for 2.5D and 3D designs. This video was recorded at the 2023 Design Automation Conference.
Learn how STMicroelectronics used Tessent defect-oriented test to improve the quality of devices for their automotive customers. This video was recorded at the 2023 European User2User conference.
