Typical allocation of functional safety within an automotive SoC.

Webinar: Meet the Challenges of ISO 26262 with Tessent Test Solutions

Register Now! Tune in on June 9, 2022 at 11:00 am (pacific daylight time) to learn how to use Tessent…

DFT, operations, and Embedded Analytics at User2User

Join Tessent at the User2User and the VOICE developer conferences

Tessent invites you to join us at three live and in-person events in May 2022. Two user community meetings, User2User…

Webinar: Smarter DFT architecture for advanced SoCs

Leonardo DaVinci said that “Simplicity is the ultimate sophistication.” Semiconductor design is a very complex process, and every step of…

Tessent earns TSMC OIP Partner of the Year for 3DFabric collaboration

Recognition of Tessent’s excellence in next-generation system-on-chip and 3DIC design enablement. Siemens EDA takes industry partnerships seriously, and sometimes we…

DFT webinar: A new method to find and optimize the most effective test patterns

Choosing the most efficient test patterns and setting coverage targets has always been a challenge and becomes even more daunting…

DFT and the competitive edge

Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be derailed by a lack of…

Join Tessent at the VOICE Developer Conference

Tessent invites you to join us at the upcoming VOICE Developer Conference happening virtually from June 21-23, 2021. VOICE is…

RealizeLIVE + User2User

Don’t miss these Tessent sessions at Realize LIVE + User2User event – May 26, 2021

Explore the latest DFT, operations and embedded analytics technologies at Realize LIVE + U2U 2021. The May 26, 2021 user…

VTS 2020 best paper_Tessent

Tessent wins Best Paper award at IEEE VLSI Test Symposium

The best paper of the 2020 symposium describes a layout-friendly EDT decompressor that reduces routing congestion associated with decompressor circuitry…