Learn how Qualcomm reduced test pattern count using Tessent testpoint technology. This video was recorded at the 2023 European User2User conference.
Learn how Testonica used Tessent to implement an FPGA-based reference system for pre-silicon evaluation and validation of a target IJTAG infrastructure. This video was recorded at the 2023 European User2User conference.
Learn how NXP Semiconductors implemented in-system test for automotive devices using Tessent, recorded at the 2023 European User2User conference.
Hear about Intel’s use of Tessent SSN for test and silicon bring up, recorded at the 2023 European User2User conference.
Suppliers of IP for automotive applications must ensure their IP blocks are ISO 26262 compliant. Siemens has the solutions for automotive safety and reliability.
Learn about faster DFT and better results using the bus-based packetized test of Tessent Streaming Scan Network.
Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.
Join Tessent at the 48th International Symposium for Testing and Failure Analysis, the premier event for the microelectronics failure analysis community.
Yes, there is a path to a scalable, affordable, and comprehensive DFT solution for 3D ICs.
