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Mastering interface planning and predictive analysis in IC design

July 16, 2025

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and…

By Tova Levy
2 MIN READ

​The hidden heat challenge of 3D ICs:  And what designers need to know

July 8, 2025

Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across…

By John McMillan
12 MIN READ

​Why Traditional PCB Methods Fall Short in 3D IC Design

June 16, 2025

In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with…

By John McMillan
11 MIN READ

​3D IC technology trends: Microarchitecture in IC design

June 3, 2025

In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in…

By John McMillan
11 MIN READ

​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

May 21, 2025

The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In…

By John McMillan
7 MIN READ
Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

By John McMillan
14 MIN READ
chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

May 11, 2025

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…

By Tova Levy
< 1 MIN READ
Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

March 19, 2025

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

By Tova Levy
2 MIN READ

3D IC design solutions: 2024 – Year in review

December 16, 2024

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

By John McMillan
3 MIN READ