3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based…

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

Taking 3DIC heterogeneous integration mainstream

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing