In our fifth podcast on 3D IC design workflows, we discussed what a 3D IC physical design workflow looks like,…
With current 3D IC packaging technologies, since the system-level netlist (the 3D IC design intent) drives system-level LVS verification, designers…
Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…
In the first podcast about 3D IC heterogeneous integration, we talked about the disaggregation of once monolithic implementation architectures into…
Why 3D IC technology matters As consumer electronic devices grow increasingly connected, intelligent, and advanced, designers need new methodologies like…
