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System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

By John McMillan
3 MIN READ

Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

November 6, 2023

Delve into the world of 3D IC technology, its architecture, benefits, and applications. Learn how it’s reshaping the future of integrated circuits for enhanced performance and efficiency.

By John McMillan
6 MIN READ

SemiWiki Podcast – An expert panel discussion on the move to chiplets

September 13, 2023

Listen in as Tony Mastroianni Advanced Packaging Solutions Director – Siemens EDA along with Saif Alam Vice President of Engineering…

By John McMillan
< 1 MIN READ
An image of a PCB with text that says IC Packaging 2.13

What’s new in Xpedition IC Packaging release VX.2.13

March 15, 2023

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…

By Keith Felton
2 MIN READ
Illustration that says next generation IC Packaging part 4

The five keys to next-generation IC packaging design: Part 4

December 14, 2022

“Golden signoff” – The final step in the semiconductor packaging process In my last blog post, I talked about the…

By Keith Felton
2 MIN READ

The five keys to next-generation IC packaging design: Part 3

November 3, 2022

Scalability and range of IC packaging design solutions In my last blog, I talked about multi-domain and cross-domain integration that…

By Keith Felton
2 MIN READ

The five keys to next-generation IC packaging design: Part 2

October 19, 2022

Multi-domain integration enables faster time to market for complex advanced semiconductor packages with a seamless integration of design and verification.

By Keith Felton
2 MIN READ

Megatrends of advanced IC packaging solutions 

August 25, 2022

Over last 2-3 years, everyone has been talking about Moore’s “Law” becoming invalid. Even if it does, we will continue…

By Keith Felton
3 MIN READ
3D IC and the system-technology co-optimization (STCO) approach

3D IC and the system-technology co-optimization (STCO) approach

August 3, 2022

Semiconductor engineers aim to deliver best-in-class devices despite technology scaling and cost limitations of monolithic integrated circuit (IC) design. To…

By anthonymastroianni
2 MIN READ