System-technology co-optimization in 3D IC design

What Lies Ahead for System-Technology Co-Optimization (STCO) in 2026

By Per Viklund The race to build ever more powerful and energy-efficient AI chips has been underway for years, but…

AI in 3D IC design

AI is reshaping the 3D IC design ecosystem: Key trends to watch in 2026

Headlines on how the global AI race leads to the shortages of GPUs in no short supply. Behind those headlines…

3D IC thermal challenges and trends 2026

Key Thermal Advances Driving Next-Gen AI Chip Design in 2026

AI is hot — literally.  As we bid farewell to a transformative year of 2025, there’s no doubt that the AI chip underwent substantial changes. As AI compute is pushing…

Illustrative example of 3D IC heat dissipation - thermal management

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With…

ic package type

Ultimate guide to IC package types: choose the right package technology

Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive…

3d ic stacked chip

2.5D vs. 3D IC: which chip packaging technology is right for you?

Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional…

3D IC rendering illustrating advanced chip packaging with vertically stacked dies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip…

Illustration of 3D IC stacked design

3D IC technology: your comprehensive guide to enabling heterogeneous integration

What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a…

chiplet integration with STCO system technology co optimization

Resolving Design Fragmentation Challenges in Chiplet Integration with STCO

Are you struggling to integrate chiplets into an advanced packaging platform due to design fragmentation challenges? The complexity of managing…