John McMillan
Sr. Content Marketing Strategist - EDA

Over 30 years in the EDA software industry. After many years as a Principal CAD Engineer performing PCB, hardware and MCAD design I've held various technical marketing leadership roles in EDA.

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

By John McMillan
3 MIN READ

Impacts of 3D IC on the future

December 20, 2023

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

By John McMillan
3 MIN READ

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023

HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.

By John McMillan
3 MIN READ

Crossing the chasm: Bringing SoC and package verification together

December 8, 2023

3D IC package designers need assembly-level LVS for HDAP verification.

By John McMillan
2 MIN READ

Package designers need assembly-level LVS for HDAP verification

December 5, 2023

While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique…

By John McMillan
2 MIN READ

Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

November 6, 2023

Delve into the world of 3D IC technology, its architecture, benefits, and applications. Learn how it’s reshaping the future of integrated circuits for enhanced performance and efficiency.

By John McMillan
6 MIN READ

SemiWiki Podcast – An expert panel discussion on the move to chiplets

September 13, 2023

Listen in as Tony Mastroianni Advanced Packaging Solutions Director – Siemens EDA along with Saif Alam Vice President of Engineering…

By John McMillan
< 1 MIN READ