Stoneridge: Addressing Digital Transformation with Xpedition Enterprise

Stoneridge’s global engineering team wanted to standardize their electronic systems engineering platform and evaluated enterprise ECAD systems to meet this…

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

NEPES partners with Siemens to streamline its advanced wafer-level IC Packaging wafer map mask creation process

Siemens’ Xpedition Package Designer automates a manual error prone process saving days of effort and reducing risk Seoul, South Korea.,…

TLA winner for Transportation & Automotive

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Telecom, Network Controllers, Line Cards

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Military & Aerospace

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Industrial Control, Instrumentation, & Medical

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Consumer Electronics & Handheld

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winner for Computers, Blades & Servers, Memory Systems

This is part of a series of blogs showcasing the winning designs from the 28th PCB Technology Leadership Awards. The…

TLA winners: Best Design Overall

The 28th PCB Technology Leadership Award (TLA) winners have been selected!