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Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

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Design with Calibre

Automated analysis-based layout enhancements reduce power grid voltage drops during place & route: A case study with Google

May 29, 2024
By Jeff Wilson Power isn’t just a small factor in the IC design arena—it’s a cornerstone. Design teams work to...
By Design With Calibre
4 MIN READ

Custom IC

Reflecting on NVIDIA’s AI-powered standard cell verification methodology

May 28, 2024
Interested in NVIDIA’s presentation at User2User 2024 Conference? Watch the recording here. The recent User2User North America conference proved to...
By Mohamed Atoua
< 1 MIN READ

EDA Support Blogs

Tessent SSN and Data Packets

May 21, 2024
The Tessent Scan Streaming Network (SSN) is a powerful tool that facilitates efficient testing of integrated circuits (ICs) by optimizing...
By Jiqing (Jonathan) Fan
< 1 MIN READ

Custom IC

Another breakthrough in Semiconductor Industry engineered by Intel Foundry

May 21, 2024
Ever since I got my first computer, I eagerly anticipated the announcement of each new Pentium processor from Intel. These...
By Lih-Jen Hou
3 MIN READ

EDA Support Blogs

Navigating Tessent OCCs and Beyond: A Comprehensive Guide to On-Chip Clock Controllers

May 21, 2024
In today’s rapidly evolving semiconductor landscape, ensuring the robustness and reliability of integrated circuits is paramount. Embedded within these circuits...
By Jyo Sanda
< 1 MIN READ

EDA Support Blogs

The Roles of Fusebox and its Interface as Part of Tessent Memory BIST Repair Solution

May 14, 2024
We have multiple inquires about Tessent Memory BIST to understand the Built-in-Self-Repair (BISR) architecture, specifically in regards to the fuse...
By Lucas Lee
2 MIN READ

Electronic Systems Design

Accelerating RF PCB design in a 5G world

May 14, 2024
The demand for high-speed and efficient RF (Radio Frequency) PCB design has never been greater. With billions of IoT devices...
By David Wiens
3 MIN READ

Semiconductor Packaging

Multiplying engineering resources for efficient package substrate design

May 14, 2024
In the world of package substrate design, the age-old saying, “many hands make light work,” holds more truth than ever....
By Keith Felton
2 MIN READ

Tessent Solutions

Maximizing SoC Performance: The Role of Embedded Software and Functional Monitors

May 07, 2024
In the rapidly evolving landscape of System on Chip (SoC) development, the demand for effective debugging and optimization is becoming...
By Tessent Solutions
2 MIN READ

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