ISTFA 2021

By Tessent Solutions

Don’t miss the 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) in Phoenix, Arizona from October 31 to November 4 2021. While you’re there, stop by to learn about the latest Tessent offerings at Siemens EDA booth 710.

On Monday November 1, Siemens EDA is one of six vendors participating in the popular “Tools of the Trade” tour starting at 5: 00pm in the Convention Center. This event is a highlight of ISTFA, but you need to pre-register for it. We will demonstrate the latest Tessent technologies with a focus on our new Reversible Scan Diagnosis.

Traditionally, early in yield ramp when yield is low, customers rely on unidirectional or tradition chain diagnosis, mostly in test chip vehicles. When a defect is detected in chain diagnosis, finding the location of that defect can be quite time consuming and costly using state of the art defect localization techniques. In the Tools of the Trade tour, you will learn how reversible scan chain design was implemented into an industrial test chip and used to find defects more effectively compared to traditional unidirectional scan chain diagnosis.

Learn more and register for the Tools of the Trade tour here:

On Tuesday November 2 at 11:00am, come see “Improving Diagnosis Resolution with Population Level Statistical Devices” presented by Dr. Kun Young Chung of Qualcomm Technologies, Inc. and co-authored with Siemens Tessent technologists. The presentation is in the Product Yield, Test, & Diagnostics session that starts at 10:10am.

Stop by the Siemens EDA booth 710 to get more in-depth technical updates on the recently announced Reversible Scan Diagnosis and other solutions for test bring-up, silicon characterization, diagnosis-driven yield analysis and failure analysis.

Register for ISTFA here:

We hope to see you there!

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This article first appeared on the Siemens Digital Industries Software blog at