Webinar: Reversible Scan Chain Technology Improves Diagnosis Resolution by 4X

Join Siemens and Qualcomm experts for a live, one-hour, online seminar: A Novel Reversible Scan Chain Technology that Improves Chain Diagnosis Resolution by 4X

When: September 23, 2021, at 9:00 AM US/Pacific.
If you can’t make the live session, please register anyway and you’ll get the link to the recorded session afterward.

The complicated silicon defect types and defect distribution for advanced technologies can lead to initially very low yield for new design with new technology. To ramp up yield as quickly as possible to meet the market window, Tessent offers a new reversible scan chain technology.

There are several approaches to ramp up yield by using real silicon, including test chips and inline particle scanning. However, we focus on Diagnosis-Driven Yield Analysis (DDYA). DDYA consists of two major parts:

  • Using scan-based testing and diagnostic technologies to quickly generate accurate volume diagnosis data
  • Applying statistical analysis to the volume diagnosis data to quickly identify systematic defects and root causes.

An ongoing aim of DDYA is to improve the diagnostic resolution. Perfect diagnostic resolution, for example, would show only one suspect cause of a failure. However, software-based scan chain diagnosis cannot guarantee the perfect diagnostic resolution because it depends on design structure and scan patterns. Tessent’s specific reversible scan chain patterns were developed to improve diagnostic resolution, and proved in an industrial case study to improves chain diagnosis resolution by 4X.

Learn more from Qualcomm and Siemens experts in this live, one-hour, online seminar: A Novel Reversible Scan Chain Technology that Improves Chain Diagnosis Resolution by 4X.

The seminar covers:

  • Traditional unidirectional scan chain diagnosis
  • Reversible scan chain diagnosis
  • Proven silicon results using reversible scan technology

Presenters are Jayant D’Souza, technical product manager at Siemens EDA; Szczepan Urban, engineering manager at Siemens EDA; and Kun Young Chung, senior staff engineer at Qualcomm Technologies.

Where: Live, online presentation, and Q&A with the expert.

Cost: An hour of your time.

Register now!

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This article first appeared on the Siemens Digital Industries Software blog at https://blogs.sw.siemens.com/tessent/2021/09/20/webinar-reversible-scan-chain-technology-improves-diagnosis-resolution-by-4x/