Automated Model Calibration in FloTHERM – A Future Cornerstone of Simulation Based Workflows, Today

Automated Model Calibration in FloTHERM – A Future Cornerstone of Simulation Based Workflows, Today

Available in the recently released FloTHERM V11.1 is the ability to calibrate a FloTHERM simulation model so that it matches…

Mentor Graphics at Semi-Therm 31 – ‘Dolly the Heatsink’ and much more

Mentor Graphics at Semi-Therm 31 – ‘Dolly the Heatsink’ and much more

Semi-Therm, the world’s largest dedicated electronics thermal conference, will take place between March 15-19 at the Doubletree Hotel in San…

Blue LEDs. Since When is Improvement Invention?

Blue LEDs. Since When is Improvement Invention?

Lighting accounts for ~20% of the world’s total energy consumption. This is a staggering statistic. Why so much? Historically a…

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology

In the royal family of thermal IC package modelling types, a detailed model is King. All critical 3D geometry is…

Experiment vs. Simulation, Part 4: Compact Thermal Models

Experiment vs. Simulation, Part 4: Compact Thermal Models

Electronics cooling simulation was born out of the world of CFD, rather fully conjugate heat transfer simulation where convective, radiative…

Experiment vs. Simulation, Part 1: Them and Us.

Experiment vs. Simulation, Part 1: Them and Us.

Before you sell it, or commission it, you want to be sure that it works. Monies have been spent on…

Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad

Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad

‘Bits stuck onto other bits’, a succinct definition of an electronic product, if not a product that contains electronics. Soldering…

LEDs; The future’s bright and hot.

LEDs; The future’s bright and hot.

LED based lighting is now a very hot topic (believe me, in electronic thermal management circles that used to be…

All Detailed Thermal IC Package Models are Wrong… Probably

All Detailed Thermal IC Package Models are Wrong… Probably

‘Rubbish In -> Rubbish Out’ is a well accepted fact in the world of simulation. Regardless of the technical capabilities…