Component-based Transfer Path Analysis masterclass in Hefei China: 140 customers excited to learn about cutting-edge technology

Component-based Transfer Path Analysis (C-TPA) masterclass, sometimes you have the feeling that something big is starting… This story begins in Hefei, a city most non-Chinese people wouldn’t know, despite having almost the same population as smaller European countries like Austria or Belgium. Located halfway between Shanghai and Wuhan, Hefei is part of the new face of modern China.

Transform Engineering Conference

But this isn’t the story I want to share in this blog. Instead, I want to tell you about our Component-based Transfer Path Masterclass, which was part of our Transform Engineering Conference. The event brought together 1200+ visitors, 20+ exhibitors, and featured 5 parallel sessions. The first day was dedicated to plenary sessions, while the second day showcased customer presentations. Then came the real excitement.

Component-based Transfer Path Analysis Masterclass

Our local Chinese team and I organized a C-TPA masterclass for over 140 customers. The demand was so high that we had to turn away additional participants, as we couldn’t accommodate more than 120 supervised seats plus some additional ones in the back of the conference room. By “supervised seats,” I mean hands-on training with direct guidance from our team. Additional attendees could observe from two rows at the back of the room, though without direct supervision.

The afternoon program comprised four sessions covering various aspects of component characterizations and virtual prototyping, including:

• Component characterization
• In-situ TPA
• Mount stiffness characterization
• NVH prediction and auralization

This is where we witnessed our customers’ true motivation and spirit. Their curiosity and eagerness to embrace cutting-edge technology for improving future vehicles was inspiring. The attendees, primarily from the automotive industry, included representatives from China’s seven largest Automotive OEMs, each sending multiple engineers. One of the highlights was seeing at maximum 140 engineers collaboratively working on virtual instrumentation, in-situ TPA, and virtual prototype assemblies.

Seeing such enthusiasm and willingness to adopt our new technology in vehicle development makes me eager for my next visit. I look forward to discussing how we can help each of you develop leading-edge products for the automotive industry and your customers.

Interested in our Simcenter testing solutions related to C-TPA and virtual prototyping? Don’t get left behind – reach out to us. We’re here to help you adopt these technologies and address your challenges, front-loading NVH development and reducing time to market.

Finally, I want to congratulate the Chinese team for making this remarkable event possible, especially my colleagues involved in the masterclass, thumbs up!

To learn more about C-TPA, check out this white paper or see the blogs listed below.