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User2User 2024: Meeting future performance demands through packaging: ChipletZ

September 27, 2024

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

By John McMillan
4 MIN READ

User2User 2024: xPD xSI PDK design enablement – Beyond Xpedition templates

July 30, 2024

PDK enablement beyond using Expedition templates, focusing on the challenges and solutions related to updating packaging tool functionality.

By John McMillan
2 MIN READ
Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024

In this User2User 2024 session Broadcom’s Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”

By John McMillan
2 MIN READ
An image of a PCB with text that says IC Packaging 2.13

What’s new in Xpedition IC Packaging release VX.2.13

March 15, 2023

The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…

By Keith Felton
2 MIN READ