The presentation features consulting project examples from Sysberry GmbH that leverage Siemens EDA tools and APIs.
PDK enablement beyond using Expedition templates, focusing on the challenges and solutions related to updating packaging tool functionality.
Efficiency in IC package design is becoming more important as design cycles shorten and complexity surges. One common approach to…
In the world of package substrate design, the age-old saying, “many hands make light work,” holds more truth than ever….
The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…
Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
The new VX.2.14 release of Xpedition IC Packaging includes improvements and enhancements to both Xpedition Substrate Integrator and Xpedition Package…
The Xpedition high density advanced packaging solution it is made up of two core products, Xpedition Substrate Integrator (xSI) which…
