Siemens Innovator 3D IC wins 3D InCites award for 2025

Siemens Innovator3D IC wins 2025 3D InCites Technology Enablement award

In the fast-evolving landscape of semiconductor technology, innovation and collaboration are key drivers of progress. As advanced interconnect and packaging…

Heterogeneous integration eBook IC Packaging

How can IC and package designers navigate the complexities of heterogeneous integration?

Heterogeneous integration has transformed the design of complex devices, enabling engineers to swiftly and affordably create advanced system-in-packages by combining…

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and…

3D IC design solutions: 2024 – Year in review

Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!…

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session…

Taking 3DIC heterogeneous integration mainstream

In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.

Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing