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New innovative way to functionally verify heterogeneous 2D/3D package connectivity

New innovative way to functionally verify heterogeneous 2D/3D package connectivity

June 6, 2024

This blog introduces a white paper that addresses the challenges of verifying
package connectivity and illustrated how to use formal tools to verify connectivity for package designs.

By John McMillan and Todd Burkholder
3 MIN READ
Two people working at a white board with text onscreen that says: Multiplying engineering resources for efficient package substrate design

Multiplying engineering resources for efficient package substrate design

May 14, 2024

In the world of package substrate design, the age-old saying, “many hands make light work,” holds more truth than ever….

By Keith Felton
2 MIN READ
Image of a chip with text that says: High Bandwidth Memory integration

Managing the complexities of High Bandwidth Memory integration in high-performance computing

March 12, 2024

The utilization of High Bandwidth Memory (HBM) has become a cornerstone for high performance computing (HPC) CPUs, GPUs, and AI…

By Keith Felton
2 MIN READ
Taking 2.5D/3D IC physical verification to the next level

Taking 2.5D/3D IC physical verification to the next level

February 21, 2024

Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.

By John McMillan
4 MIN READ

A deep dive into HDAP LVS/LVL verification

January 29, 2024

EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.

By John McMillan
4 MIN READ
Siemens 3D IC heterogeneous semiconductor packaging workflows catapult design teams into the future of IC design today.

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.

By John McMillan
4 MIN READ
Image of a chip on a board with text that says Navigating complexities in power delivery analysis: embracing the shift-left approach

Navigating complexities in power delivery analysis: embracing the shift-left approach

January 9, 2024

The demand for increased power and performance in semiconductor packages has surged. As more die and chiplets are integrated into…

By Keith Felton
2 MIN READ

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024

Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.

By John McMillan
3 MIN READ

Impacts of 3D IC on the future

December 20, 2023

3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic…

By John McMillan
3 MIN READ