Designing advanced package layouts with large areas of metal can be a daunting task, given the stringent requirements imposed by…
In the ever-evolving realm of semiconductor technology, one innovation stands out above the rest: High Bandwidth Memory (HBM). Offering unparalleled…
We have witnessed and learned about the industry’s significant shift in semiconductors. The traditional approach of transistor scaling, once universally…
Advancements in IC packaging manufacturing, combined with the exploding costs of designing monolithic ICs on today’s advanced process nodes, have…
Designs are just getting bigger and more complex Yes, an obvious aspect is increasing design complexity. Packages are now a…
The connectivity management complexity of package assemblies where multiple chiplets/ASICs and memory are heterogeneously integrated, introduces a great deal of…
If you’re designing a high-performance processor-based package, it’s common for the semiconductor package design to contain multiple logic chips that…
People have been designing “modules” or system-in-packages (SiP) for a number of years; but in the last 3-5 years, I…
