Mastering interface planning and predictive analysis in IC design

By Tova Levy

From optimizing connectivity to ensuring electrical performance, designers are tasked with meticulous planning and execution to achieve seamless communication and functionality across silicon, packages, interposers, and PCBs.

Traditional methodologies often fall short in addressing the complexities of interface planning, leading to issues such as route congestion, signal integrity challenges, and suboptimal design quality. Manual or automated routing processes without pre-planned paths can result in blockages, congestion, and compromised performance, necessitating iterative and time-consuming design iterations.

To navigate these challenges and drive design optimization, a holistic approach combining methodology and advanced design tools is essential.

The eBook “Heterogeneous chiplet integration: Navigating interconnect planning and electrical optimization“, by Keith Felton, IC Packaging product marketing manager, focuses on the crucial stages of interface planning and predictive analysis-driven scenario completion. By emphasizing the importance of chiplet interface route planning and optimization, designers are equipped to make informed decisions that ensure optimal power, performance, and cost trade-offs. Predictive analysis plays a pivotal role in evaluating design scenarios, enabling designers to anticipate challenges and make necessary adjustments to meet performance goals.

This eBook is the third in a four-part series which outlines the 10-step methodology of heterogeneous integration, laying the foundation for a structured and comprehensive approach to IC design optimization. By embracing a hierarchical interface route-path planning process and leveraging early multiphysics predictive analysis, designers can streamline the design process, minimize latency, and enhance communication efficiency between chiplets.

The journey towards mastering interface planning and predictive analysis in IC design is one of continuous learning and innovation. By downloading the eBook, designers gain access to practical strategies and best practices that empower them to overcome design challenges, reduce dependency on experts, and drive excellence in chiplet integration.

Download the eBook today and embrace the future of IC design optimization.