what's new in Z-planner 2510

What’s new in Z-planner Enterprise 2510

The Z-planner Enterprise 2510 release of Z-planner continues to refine the product by focusing on simulation accuracy, overall ease of use and collaboration.

What's new in Valor NPI 2510

What’s new in Valor NPI 2510

The Valor NPI 2510 release brings additional checks, better manufacturing awareness and  exciting visual enhancements that show a significant evolution of the product offering.

What's new Z-planner Enterprise 2504

What’s new in Z-planner Enterprise 2504

Z-planner Enterprise 2504 release The latest 2504 release of Z-planner Enterprise delivers powerful updates that streamline stackup planning, improve rigid-flex…

What's new in Valor NPI 2504

What’s new in Valor NPI 2504

The latest Valor NPI 2504 release delivers powerful enhancements that make your Design for Manufacturing (DFM) analysis faster, more intelligent,…

Automated DFM in electronics manufacturing

Navigating the Transition to Automated DFM Solutions in Automotive Electronics

In the fast-paced world of automotive electronics, staying ahead of the curve is essential. With the rapid advancements in technology…

DFM collaborator view in PCBflow

DFM profile collaboration and management

I have always had a certain affinity for the saying ‘the definition of insanity is doing the same thing over…

Data safety in PCBflow

How the PCBflow platform keeps your data safe

A look at how PCBflow keeps your board design and manufacturing capability files secure

Icons of file folders

Design for manufacturing output files – optimizing engineering to manufacturing efficiency

As PCB design and manufacturing become increasingly complex, the choice of design for manufacturing output files plays a crucial role in streamlining processes, reducing errors, and improving time to market.

blind and buried vias

Blind and buried vias: An HDI technology

One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space.