The Internet of Things – Seize its Opportunities, Tackle Its Challenges

The Internet of Things – Seize its Opportunities, Tackle Its Challenges

Looking at our world today, you must have reflected on how much the connected world, the Internet of Things, has…

The Simulation Advantage

The Simulation Advantage

The advent of high-speed serial links added many challenges to the process of designing PCBs.  In some ways, it made…

Correlation up to 50GHz

Correlation up to 50GHz

Last week I attended DesignCon, and as usual correlation between simulation and measurement was a hot topic, especially for the…

Designing PCB’s for IoT – Part 1: IoT Everywhere

Designing PCB’s for IoT – Part 1: IoT Everywhere

A recent IHS report forecasted that the IoT market will grow from an installed base of 15.4 billion devices in…

Silicon Valley IC Packaging Seminar Validates Growing Proliferation of FOWLP

Silicon Valley IC Packaging Seminar Validates Growing Proliferation of FOWLP

If you’re interested in High Density Advanced Packaging (HDAP), our recent, focused seminar at Mentor Graphics’ Fremont campus was the…

Multi-board – What’s Your Definition?

Multi-board – What’s Your Definition?

Recently, while researching system design software, I was struck by how often the term multi-board was mentioned. As I began…

Redefining the Corner Office

Redefining the Corner Office

At the beginning of EDA, a corner office was the indication that you were at the top of the organization….

Attention all Altium Designer Users!!!

Attention all Altium Designer Users!!!

Are your current PCB design tools running out steam? Are you still waiting for that extra capacity you need to…

Increase the Reliability of Your Next Design

Increase the Reliability of Your Next Design

If someone were to ask you what the acronym DfM stood for, you would most likely quickly respond with a…