John McMillan
Sr. EDA Marketing Strategist

John has over 30 years in the EDA software industry. After many years as a Principal CAD Engineer performing PCB, hardware and MCAD design John has held various technical, marketing and R&D leadership roles in the EDA industry.

The digital transformation imperative: Are your engineering processes built for tomorrow’s electronics market?

The digital transformation imperative: Are your engineering processes built for tomorrow’s electronics market?

January 12, 2026
In today’s hyper-competitive electronics landscape, the brutal truth is this: traditional, siloed development processes are no longer just inefficient—they’re existential threats...
By John McMillan
< 1 MIN READ
From 2.5D to true 3D IC: What’s driving the next wave of integration.​

From 2.5D to true 3D IC: What’s driving the next wave of integration.​

October 8, 2025
With 3D IC integration blurring the lines between chip and package, is your team’s mindset truly system-centric, or are traditional...
By John McMillan
< 1 MIN READ
Why every 3D IC needs a test vehicle before it hits production​

Why every 3D IC needs a test vehicle before it hits production​

September 22, 2025
Would you risk millions of dollars on a semiconductor design without knowing if it can be manufactured? Discover why test...
By John McMillan
< 1 MIN READ
Breaking down 50 million pins: A smarter way to design 3D IC packages​

Breaking down 50 million pins: A smarter way to design 3D IC packages​

September 3, 2025
As 3D IC complexity skyrockets, are we truly evolving our design methodologies at the same pace, or are we unknowingly...
By John McMillan
< 1 MIN READ
Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

Navigating signal integrity and power integrity (SI/PI) in 3D IC design​

August 19, 2025
Q: Is dedicated SI/PI analysis still necessary in 3D IC design? A: With the rapid advancements in chip design automation...
By John McMillan
< 1 MIN READ
IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

IC package thermal resistance: Accurate modeling for system-level IC thermal reliability

August 19, 2025
As semiconductor devices grow more powerful and complex, effective thermal management has become a top priority in IC design. With...
By John McMillan
< 1 MIN READ
How to Design Smarter: System-level multiphysics in 3D integration​

How to Design Smarter: System-level multiphysics in 3D integration​

August 7, 2025
What happens when a perfectly functioning chip fails to perform in a 3D IC package? As semiconductor designs stack multiple...
By John McMillan
< 1 MIN READ
Ultimate guide to IC package types: choose the right package technology

Ultimate guide to IC package types: choose the right package technology

July 28, 2025
Integrated circuits (ICs) are the foundation of modern electronics, powering everything from smartphones and medical devices to servers and automotive...
By John McMillan
< 1 MIN READ
Your blueprint for next-gen 3D IC success

Your blueprint for next-gen 3D IC success

July 21, 2025
In today’s semiconductor landscape, traditional scaling approaches are hitting physical and economic limits. The industry is pivoting toward 3D IC...
By John McMillan
< 1 MIN READ
​Why 3D ICs need a mindset shift and how to make it happen

​Why 3D ICs need a mindset shift and how to make it happen

July 17, 2025
What if the most revolutionary advances in semiconductor design aren’t about making things smaller, but about fundamentally reimagining how we...
By John McMillan
< 1 MIN READ
​The hidden heat challenge of 3D ICs:  And what designers need to know

​The hidden heat challenge of 3D ICs:  And what designers need to know

July 8, 2025
Why is thermal analysis no longer an afterthought in 3D IC design—and what is Siemens doing to empower engineers across...
By John McMillan
< 1 MIN READ
2.5D vs. 3D IC: which chip packaging technology is right for you?

2.5D vs. 3D IC: which chip packaging technology is right for you?

June 24, 2025
Why 2.5D vs. 3D IC matters in modern chip design As semiconductor innovation pushes the limits of Moore’s Law, traditional...
By John McMillan
< 1 MIN READ
​Why Traditional PCB Methods Fall Short in 3D IC Design

​Why Traditional PCB Methods Fall Short in 3D IC Design

June 16, 2025
In this episode of the Siemens 3D IC Podcast Series,we delve into the world of FOWLP (Fan-out wafer-level packaging) with...
By John McMillan
< 1 MIN READ
Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

Chip packaging explained: From IC packaging basics to advanced 2.5D and 3D IC technologies

June 5, 2025
Understanding the evolution and importance of chip packaging As semiconductor innovation pushes the boundaries of performance and power efficiency, chip...
By John McMillan
< 1 MIN READ
Achieving manufacturing excellence in 3D IC design

Achieving manufacturing excellence in 3D IC design

June 4, 2025
The semiconductor industry is undergoing a pivotal evolution, fueled by the adoption of 3D IC and innovative packaging technologies. Achieving...
By John McMillan
< 1 MIN READ
​3D IC technology trends: Microarchitecture in IC design

​3D IC technology trends: Microarchitecture in IC design

June 3, 2025
In this latest Siemens EDA 3D IC podcast episode, we explore microarchitecture’s crucial role in 3D IC design. Listen in...
By John McMillan
< 1 MIN READ
🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

🎧 Subscribe to the 3D IC podcast — your front row seat to the future of chip design

June 3, 2025
Listen now on your favorite platform: 🔹 Spotify🔹 Apple Podcasts🔹 Amazon Music🔹 YouTube Playlist 👉 Don’t forget to bookmark the...
By John McMillan
< 1 MIN READ
​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

​3D IC technology trends: how advanced IC packaging is changing the semiconductor industry

May 21, 2025
The semiconductor industry is rapidly evolving with 3D IC technology and advanced packaging solutions revolutionizing chip design and manufacturing. In...
By John McMillan
< 1 MIN READ
3D IC technology: your comprehensive guide to enabling heterogeneous integration

3D IC technology: your comprehensive guide to enabling heterogeneous integration

May 19, 2025
What is 3D IC technology? 3D IC technology refers to the integration of multiple silicon dies or wafers in a...
By John McMillan
< 1 MIN READ
Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

Accelerate IC design innovation with Siemens: Navigating the future of 3D IC design to manufacturing

March 7, 2025
In the rapidly evolving semiconductor industry, the drive towards miniaturization and the integration of complex functions through advanced packaging and...
By John McMillan
< 1 MIN READ
3D IC design solutions: 2024 – Year in review

3D IC design solutions: 2024 – Year in review

December 16, 2024
Welcome to a look back at a landmark year in 3D IC technology — 2024 was nothing short of revolutionary!...
By John McMillan
< 1 MIN READ
User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

User2User 2024: Pioneering semiconductor reliability automotive apps – imec’s Canary chip

November 5, 2024
In this User2User 2024 presentation, Dr. Thomas Kallstenius, representing imec, the world’s leading independent research institute specializing in nanoelectronics, whose Belgium-based...
By John McMillan
< 1 MIN READ
EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

EE Times Fireside chat: Linking design to manufacturing for a sustainable semiconductor future

October 21, 2024
Listen in as Michael Munsey, VP at Siemens EDA, joins EE Times’ Sally Ward-Foxton for a Fireside chat Q&A session...
By John McMillan
< 1 MIN READ
User2User 2024: Customer-specific solutions with Siemens EDA tools: Sysberry GmbH

User2User 2024: Customer-specific solutions with Siemens EDA tools: Sysberry GmbH

October 15, 2024
The presentation features consulting project examples from Sysberry GmbH that leverage Siemens EDA tools and APIs.
By John McMillan
< 1 MIN READ
Taking 3DIC heterogeneous integration mainstream

Taking 3DIC heterogeneous integration mainstream

October 2, 2024
In this presentation, we will explore the challenges introduced by 3DIC, the current state of the industry to address those challenges, the ecosystem needed to support 3DIC, and how users today can successfully adopt 3DIC leveraging new solutions, workflows, and 3DIC Design Kits (3DK) from Siemens EDA that are designed specifically with 3DIC in mind.
By John McMillan
< 1 MIN READ
User2User 2024: Meeting future performance demands through packaging: ChipletZ

User2User 2024: Meeting future performance demands through packaging: ChipletZ

September 27, 2024
Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.
By John McMillan
< 1 MIN READ
Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

September 24, 2024
Learn about Siemens' Tessent Multi-die solution for 3DIC packaging.
By John McMillan
< 1 MIN READ
User2User 2024: Silicon photonics to integrate chiplets: Swissbit

User2User 2024: Silicon photonics to integrate chiplets: Swissbit

September 17, 2024
Swissbit is pioneering chiplet and system-on-package solutions that embed security and functional safety from the design phase to meet stringent requirements in harsh industrial and automotive environments.
By John McMillan
< 1 MIN READ
User2User 2024: Chiplets for future automotive application: Fraunhofer

User2User 2024: Chiplets for future automotive application: Fraunhofer

September 11, 2024
Andy Heinig, Head of Department Efficient Electronics at Fraunhofer, explains why automotive is especially a good market and enabler for chiplets and presents different use cases for chiplets that are on the horizon.
By John McMillan
< 1 MIN READ
The evolution of machine learning (ML) in the physical design and verification of semiconductor packages

The evolution of machine learning (ML) in the physical design and verification of semiconductor packages

August 14, 2024
Discover how Siemens' EDA evolution of machine learning in the physical design and verification of semiconductor packages.
By John McMillan
< 1 MIN READ
User2User 2024: EMIB based advanced packaging flow – Intel Foundry

User2User 2024: EMIB based advanced packaging flow – Intel Foundry

August 12, 2024
Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.
By John McMillan
< 1 MIN READ
Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

August 8, 2024
Explore this infographic to learn why a comprehensive workflow essential for chiplet design and today's 3D IC architectures.
By John McMillan
< 1 MIN READ
The multi-physics challenge: Known good die may not behave in 3D IC as stand alone!

The multi-physics challenge: Known good die may not behave in 3D IC as stand alone!

August 5, 2024
Discover how Siemens' EDA tackles the multi-physics challenge to achieve fast, accurate assembly-level physical verification.
By John McMillan
< 1 MIN READ
Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

Siemens introduces Innovator3D IC – a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

July 31, 2024
Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing
By John McMillan
< 1 MIN READ
User2User 2024: xPD xSI PDK design enablement – Beyond Xpedition templates

User2User 2024: xPD xSI PDK design enablement – Beyond Xpedition templates

July 30, 2024
PDK enablement beyond using Expedition templates, focusing on the challenges and solutions related to updating packaging tool functionality.
By John McMillan
< 1 MIN READ
3D InCites Podcast – Siemens’ AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs

3D InCites Podcast – Siemens’ AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs

July 29, 2024
Siemens' AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs
By John McMillan
< 1 MIN READ
The role of AI-infused EDA solutions for semiconductor-enabled products and systems

The role of AI-infused EDA solutions for semiconductor-enabled products and systems

July 23, 2024
Discover why semiconductor-enabled products and systems are demanding AI-infused solutions and how AI is changing the nature of semiconductor design.
By John McMillan
< 1 MIN READ
Discover how AI is changing the nature of semiconductor design

Discover how AI is changing the nature of semiconductor design

July 16, 2024
AI is shaping the semiconductor industry’s future and its alignment with Siemens’ commitment to innovation and enhancing sustainability by accelerating...
By John McMillan
< 1 MIN READ
User2User 2024: Assembly verification flow for silicon interposers

User2User 2024: Assembly verification flow for silicon interposers

July 15, 2024
In this User2User 2024 session Broadcom's Suvarna Vikhankar presents “Assembly Verification Flow for Silicon Interposers with Embedded Deep Trench Capacitance”
By John McMillan
< 1 MIN READ
User2User 2024: Advanced physical verification flows for 3D IC’s

User2User 2024: Advanced physical verification flows for 3D IC’s

June 25, 2024
In this User2User 2024 video presentation, now available on-demand, Microsoft’s Amit Kumar discusses 3D IC verification flows with a focus...
By John McMillan
< 1 MIN READ
New innovative way to functionally verify heterogeneous 2D/3D package connectivity

New innovative way to functionally verify heterogeneous 2D/3D package connectivity

June 6, 2024
This blog introduces a white paper that addresses the challenges of verifying package connectivity and illustrated how to use formal tools to verify connectivity for package designs.
By John McMillan
< 1 MIN READ
Taking 2.5D/3D IC physical verification to the next level

Taking 2.5D/3D IC physical verification to the next level

February 21, 2024
Taking 2.5D/3D IC physical verification to the next level. As package designs continue to evolve, so must the verification requirements. Designers working on even the most complex multi-die, multi-chiplet stacked configurations require enhanced checking capabilities to quickly and easily verify that the physical die are placed correctly to ensure proper connectivity and electrical behavior.
By John McMillan
< 1 MIN READ
A deep dive into HDAP LVS/LVL verification

A deep dive into HDAP LVS/LVL verification

January 29, 2024
EDA companies are developing tools and workflows to support HDAP (High-density advanced packaging) LVS/LVL verification. Though the data for achieving “signoff-level” confidence is a work in progress, EDA companies are providing tools that can adapt to different levels of data availability and enable HDAP designers to execute HDAP LVS/LVL flows that are both productive and beneficial.
By John McMillan
< 1 MIN READ
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging

January 11, 2024
Workflows for tackling heterogeneous integration of chiplets for 2.5D/3D semiconductor packaging.
By John McMillan
< 1 MIN READ
Parasitic extraction technologies: Advanced node and 3D-IC design

Parasitic extraction technologies: Advanced node and 3D-IC design

January 2, 2024
Advanced nodes and 3D-IC packages require new and enhanced parasitic extraction processes that can resolve a variety of complex parasitic issues in these designs.
By John McMillan
< 1 MIN READ
Impacts of 3D IC on the future

Impacts of 3D IC on the future

December 20, 2023
3D IC technology development started many years ago well before the slowing down of Moore’s law benefits became a topic...
By John McMillan
< 1 MIN READ
System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

System-level, post-layout electrical analysis for high-density advanced packaging (HDAP)

December 18, 2023
HDAP designs like FOWLP need post-layout simulation (analog) and post-layout STA (digital) flows to augment basic physical verification DRC and LVS.
By John McMillan
< 1 MIN READ
Crossing the chasm: Bringing SoC and package verification together

Crossing the chasm: Bringing SoC and package verification together

December 8, 2023
3D IC package designers need assembly-level LVS for HDAP verification.
By John McMillan
< 1 MIN READ
Package designers need assembly-level LVS for HDAP verification

Package designers need assembly-level LVS for HDAP verification

December 5, 2023
While advanced integrated circuit (IC) packaging is a fast-growing market, comprehensive package verification still has a ways to go. Unique...
By John McMillan
< 1 MIN READ
Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

Understanding 3D IC Technology: Unveiling the Future of Integrated Circuits

November 6, 2023
Delve into the world of 3D IC technology, its architecture, benefits, and applications. Learn how it's reshaping the future of integrated circuits for enhanced performance and efficiency.
By John McMillan
< 1 MIN READ
SemiWiki Podcast – An expert panel discussion on the move to chiplets

SemiWiki Podcast – An expert panel discussion on the move to chiplets

September 13, 2023
Listen in as Tony Mastroianni Advanced Packaging Solutions Director – Siemens EDA along with Saif Alam Vice President of Engineering...
By John McMillan
< 1 MIN READ
What’s New in Xpedition IC Packaging-VX.2.11

What’s New in Xpedition IC Packaging-VX.2.11

March 29, 2022
Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package...
By John McMillan
< 1 MIN READ
PADS Professional VX.2.11 is Now Available!

PADS Professional VX.2.11 is Now Available!

March 28, 2022
PADS Professional solves the problems other unified PCB design tools don’t. With industry-leading placement, routing, and analysis technologies, PADS Professional contains everything you need...
By John McMillan
< 1 MIN READ
Plug-and-Play PID design – In the SystemVision Cloud!

Plug-and-Play PID design – In the SystemVision Cloud!

December 11, 2020
Did you ever wish you could just play with a PID control loop, to try “tuning” those P, I and...
By John McMillan
< 1 MIN READ
Mentor Communities Have a New Home!

Mentor Communities Have a New Home!

November 23, 2020
Mentor communities are now fully integrated with the Siemens Digital Industries Software communities. This integrated PCB Systems Design community experience...
By John McMillan
< 1 MIN READ
PADS Professional VX.2.8 is Now Available!

PADS Professional VX.2.8 is Now Available!

November 20, 2020
The new release of PADS Professional VX.2.8 is now available for download.
By John McMillan
< 1 MIN READ
Xpedition® VX.2.8 is now available for download!

Xpedition® VX.2.8 is now available for download!

November 10, 2020
Before you read on, a newer version of Xpedition is now available. To learn more, visit the VX.2.12 product highlights...
By John McMillan
< 1 MIN READ