Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

User2User 2024: EMIB based advanced packaging flow – Intel Foundry

August 12, 2024

Learn how Intel uses 3DIC verification to leverage Siemens XSI & Calibre 3DSTACK for DRC, LVS, assembly checks. Explore methodologies for high-performance systems.

By John McMillan

Semiconductor Packaging

Why is a comprehensive workflow essential for chiplet design and today’s 3D IC architectures?

August 08, 2024

Explore this infographic to learn why a comprehensive workflow essential for chiplet design and today's 3D IC architectures.

By John McMillan

Hardware Assisted Verification

Facing a New Age of IC Design Challenges Part 2

August 08, 2024

In an industry accustomed to incremental change, Veloce CS is a departure because it is a complete three-in-one system, a...

By Jean-Marie Brunet

Electronic Systems Design

Modern day PCB design in the age of AWS cloud (Part 2 of 3: Securing the collaborative process)

August 06, 2024

In Part 1 of our blog series, we learned about the partnership between Siemens EDA and AWS and how it...

Calibre IC Design & Manufacturing

Cracking the code: ensuring reliability and performance in IC design with EM/IR analysis

August 05, 2024

By Karen Chow and Joel Mercier Integrated circuits (ICs) are everywhere, powering everything from washing machines and TVs to medical...

By Calibre IC Design & Manufacturing

Semiconductor Packaging

The multi-physics challenge: Known good die may not behave in 3D IC as stand alone!

August 05, 2024

Discover how Siemens' EDA tackles the multi-physics challenge to achieve fast, accurate assembly-level physical verification.

By John McMillan

Cre8Ventures (Siemens EDA)

Revolutionizing the Automotive Industry with Quside, Siemens Cre8Ventures, and Digital Twins

August 02, 2024

Pioneering Change with Quside and Siemens Cre8Ventures In a groundbreaking move set to redefine the automotive industry’s technological landscape, Quside...

By Carson Bradbury

Semiconductor Packaging

Siemens introduces Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

Innovator3D IC - a comprehensive multiphysics cockpit for 3D IC design, verification and manufacturing

By John McMillan

Semiconductor Packaging

User2User 2024: xPD xSI PDK design enablement - Beyond Xpedition templates

PDK enablement beyond using Expedition templates, focusing on the challenges and solutions related to updating packaging tool functionality.

By John McMillan