Siemens EDA Blogs

Siemens EDA’s mission is to help you engineer a smarter future faster. Read our latest blog posts to keep up to date on the latest tools, trends, methodologies and offerings in IC, advanced packaging and PCB systems electronics design, verification and manufacturing.

Semiconductor Packaging

User2User 2024: Meeting future performance demands through packaging: ChipletZ

September 27, 2024

Learn how 3DIC tech enhances compact, high-performance systems but faces verification challenges. We explore solutions and methodologies, including the use of Siemens XSI and Calibre 3DSTACK.

By John McMillan

Calibre IC Design & Manufacturing

Navigating the complex world of resistance extraction for curvilinear shapes in IC designs

September 26, 2024

By Nada Tarek As integrated circuit (IC) designs continue to push the boundaries of what’s possible, we’re seeing an explosion...

By Calibre IC Design & Manufacturing

Electronic Systems Design

Advanced tools aren’t everything: optimizing electronics design workflows

September 26, 2024

Electronics design is challenging not only from a technical perspective; workflow practices and organizational culture can also stand in the...

Cre8Ventures (Siemens EDA)

Chevin Technology: Innovating the Automotive Industry through Siemens Cre8Ventures Automotive Marketplace

September 25, 2024

Chevin Technology, a leader in high-performance FPGA IP cores and design services, offers an innovative solution for securing silicon supply...

By Carson Bradbury

Semiconductor Packaging

Enabling comprehensive DFT for chiplets and 3DICs using Tessent Multi-die

September 24, 2024

Learn about Siemens' Tessent Multi-die solution for 3DIC packaging.

By John McMillan

Electronic Systems Design

Keys to successful ECAD-MCAD collaboration

September 24, 2024

ECAD-MCAD collaboration is crucial In today’s complex world of product design and development. As product designs evolve, involving smaller IC...

By Stephen V. Chavez

How Solido’s AI-Assisted Design Optimization Handles Extensive Design Spaces

September 23, 2024

At the Design Automation Conference 2024, I had the opportunity to sit down with Austin Rhodes from Micron Technology at...

By Mohamed Atoua

Hardware Assisted Verification

Supercharge Your HAV Investment with Veloce ES (Enterprise Server) App

September 19, 2024

In today’s fast-paced world of hardware design and verification, accelerating time-to-market and optimizing resources are paramount. Hardware-Assisted Verification (HAV) significantly...

By Chenguang Li

Electronic Systems Design

What’s new in Xpedition 2409

September 19, 2024

The latest 2409 release of Xpedition marks a significant milestone in Siemens’ journey to redefine electronic systems design. This release...