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Driving 3D IC innovation with Calibre multiphysics: A holistic approach for next-generation design

September 18, 2025

By John Ferguson Fun fact: The concept of 3D integrated circuits (3D ICs) has been around since shortly after the…

By Design With Calibre
5 MIN READ

Revolutionizing 3D IC design with integrated multiphysics verification

August 12, 2025

By Yoyo Li The semiconductor landscape is always evolving—sometimes quietly, sometimes at breakneck pace. Today, as integrated circuit designs progress…

By Design With Calibre
5 MIN READ

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

July 2, 2025

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…

By Design With Calibre
4 MIN READ