3D IC

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Tackling compute complexity in ESD verification with Calibre

April 23, 2026

Explore how Calibre PERC and Calibre 3DPERC tackle the escalating compute complexity of ESD verification in advanced IC designs, including 2.5D and 3DIC structures, ensuring robust protection and signoff-quality results

By Calibre IC Design & Manufacturing
6 MIN READ

Meeting the challenges of reliability verification for the era of 3D ICs

April 1, 2026

Advanced reliability verification for 2.5D/3D ICs with Innovator3D IC and Calibre 3DPERC. Ensure robust reliability and accelerate sign-off.

By Calibre IC Design & Manufacturing
4 MIN READ

Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

July 16, 2025

By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints…

By Calibre IC Design & Manufacturing
5 MIN READ

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

July 2, 2025

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…

By Calibre IC Design & Manufacturing
4 MIN READ

Navigating ESD challenges in 2.5D/3D ICs: A guide to robust automated verification

November 19, 2024

By Dina Medhat Electrostatic discharge (ESD) events cause severe damage to unprotected integrated circuits (ICs). ESD events cause severe damage…

By Calibre IC Design & Manufacturing
3 MIN READ

Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

November 12, 2024

Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software…

By Calibre IC Design & Manufacturing
2 MIN READ