3D IC - Design with Calibre

Navigating 3D IC stress: physical realities and best practices for 3D IC reliability

July 16, 2025

By Shetha Nolke As the semiconductor industry shifts toward heterogeneous 3D ICs, exciting benefits are coming within reach—from smaller footprints…

By Design With Calibre

5 MIN READ

Stress less, innovate more: ensuring 3D IC reliability with Siemens Calibre 3DStress

July 2, 2025

The march toward 3D ICs and advanced packaging brings unrivaled performance and integration opportunities—but it also raises new reliability challenges…

By Design With Calibre

4 MIN READ

Navigating ESD challenges in 2.5D/3D ICs: A guide to robust automated verification

November 19, 2024

By Dina Medhat Electrostatic discharge (ESD) events cause severe damage to unprotected integrated circuits (ICs). ESD events cause severe damage…

By Design With Calibre

3 MIN READ

Siemens Calibre 3DThermal wins 2024 WEAA award for innovation in 3D IC thermal analysis

November 12, 2024

Siemens Digital Industries Software’s Calibre® 3DThermal tool was awarded the 2024 AspenCore World Electronics Achievement Award (WEAA) in the EDA/IP/Software…

By Design With Calibre

2 MIN READ