Tessent earns TSMC OIP Partner of the Year for 3DFabric collaboration

Recognition of Tessent’s excellence in next-generation system-on-chip and 3DIC design enablement. Siemens EDA takes industry…

Tessent resources from the AI Hardware Summit 2021

The AI Hardware Summit wrapped up on 15 September, 2021 at the Computer History Museum…

DFT and the competitive edge

Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place…

Webinar: Building AI Chips that Deliver

Experts from Siemens, Groq, Hewlett Packard Enterprise, and Mythic team up to discuss AI chip…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor…