Where design and innovation meets tomorrow Siemens EDA is looking forward to exhibiting a broad array of technologies spanning from…
Leonardo DaVinci said that “Simplicity is the ultimate sophistication.” Semiconductor design is a very complex process, and every step of…
Recognition of Tessent’s excellence in next-generation system-on-chip and 3DIC design enablement. Siemens EDA takes industry partnerships seriously, and sometimes we…
The AI Hardware Summit wrapped up on 15 September, 2021 at the Computer History Museum in Mountain View, CA. The…
Smart DFT for quality and TTM Don’t let your plans for successful new SoCs be derailed by a lack of…
Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place for those acceleratingAI workloads in…
Experts from Siemens, Groq, Hewlett Packard Enterprise, and Mythic team up to discuss AI chip design and deployment. Please join…
Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and ML chips. Our new on-demand…
Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor trace and a range of…
