Where design and innovation meets tomorrow
Siemens EDA is looking forward to exhibiting a broad array of technologies spanning from IC architecture design to PCB systems solutions (booth #714) at GOMACTech on March 22-23 at the Hyatt Regency in Miami, Florida.
Also, as part of Session 5: Integrated Photonics Systems & Components, Siemens EDA’s own Keith Felton and Kevin Rinebold will co-present the findings of their co-authored paper that combines two very hot topics: 3D IC design and silicon photonics – “Assembly Verification of 3D-integrated Silicon Photonics Transceiver” on Tuesday, March 22nd during the 1:30PM-3:10PM (EDT) session.
Here is the abstract:
Silicon photonic integrated circuits (ICs) have the potential to revolutionize data communication by enabling the integration of photonics and electrical chips. The unique challenges of this integration require new mechanisms for the transceivers that transition data between the electrical and optical domains. In a joint project between UC-Davis, Texas A&M University, sponsored by the United States Department of Energy and supported by Siemens Digital Industries Software, we explore the critical need to reduce the amount of energy dissipated in data movement between compute nodes. The primary goal is to develop an energy-efficient optical transceiver based on a wavelength-division multiplexing (WDM) scheme with multiple 33 Gb/s channels operating on individual optical wavelengths. In this paper, we describe the process used to select the final design structure, the techniques adopted for layout vs. schematic (LVS) design verification, and the results we achieved.
As part of the Siemens Xcelerator portfolio, Siemens offers the industry’s broadest portfolio that breaks down the barriers between electrical, software and mechanical engineering disciplines to enable enterprises to fully deploy model-based system engineering (MBSE) methodologies and develop comprehensive digital twins of complete systems and test them thoroughly before committing to manufacturing and deployment. What’s more, with Tessent Embedded Analytics solutions, Siemens offers a way for enterprises to insert IP into their ICs that will monitor IC and system health and security. This allows enterprises to detect IC or even systems problems early, perform preventative maintenance or simply use the data to build better next-generation products.
Established in 1968, GOMACTech was originally conceived to review developments in microcircuit applications for government systems. Over the years, the conference has evolved to broaden its focus on advances in systems being developed by the Department of Defense and other government agencies. The conference has also been used to announce major government microelectronics initiatives such as VHSIC and MIMIC and provides a forum for government reviews.
Siemens EDA looks forward to meeting with you in-person at GOMACTech 2022 in Miami.
Click here to register for the conference (US citizens / US permanent residents only).