A new way of measuring heterogeneous SoC performance

Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT,
and server designs.

Join Siemens EDA at GOMACTech 2022

Where design and innovation meets tomorrow Siemens EDA is looking forward to exhibiting a broad array of technologies spanning from…

Webinar: Smarter DFT architecture for advanced SoCs

Leonardo DaVinci said that “Simplicity is the ultimate sophistication.” Semiconductor design is a very complex process, and every step of…

For secure chips, use high-quality test and embedded analytics

There is growing concern over the security of ICs used not just in aerospace and military devices, but also in…

Watch videos from the AI Hardware Summit 2021

The AI Hardware Summit wrapped up on 15 September, 2021 at the Computer History Museum in Mountain View, CA. The…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place for those acceleratingAI workloads in…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and ML chips. Our new on-demand…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor trace and a range of…

Manage automotive test, safety, and security with a safety island

The makers of automotive ICs are living in “interesting times.” These ICs no longer only run simple functions such as window…