Watch videos from the AI Hardware Summit 2021

The AI Hardware Summit wrapped up on 15 September, 2021 at the Computer History Museum in Mountain View, CA. The…

Automotive electronics solutions at AESIN Conference 2021

A successful Automotive Electronics Innovation (AESIN) conference at the UK’s National Motorcycle Museum in Solihull wrapped up on 16 September…

Tessent at 2021 Automotive Electronics Innovation (AESIN) Conference

Siemens is a headline sponsor of the 2021 Automotive Electronics Innovation (AESIN) Conference taking place at the UK’s National Motorcycle…

Tessent at the 2021 AI Hardware Summit

Don’t miss the AI Hardware Summit from September 13-16, 2021. The summit is THE place for those acceleratingAI workloads in…

Webinar – Optimize manycore AI and ML designs

Turn complexity into a competitive advantage by harnessing system-level data to optimize manycore AI and ML chips. Our new on-demand…

Tessent SystemInsight: simultaneous analysis of hardware and software in complex SoC designs

Newly renamed and upgraded, the Tessent™ SystemInsight integrated development environment (IDE) now supports cycle-accurate processor trace and a range of…

Manage automotive test, safety, and security with a safety island

The makers of automotive ICs are living in “interesting times.” These ICs no longer only run simple functions such as window…

Join Tessent at the VOICE Developer Conference

Tessent invites you to join us at the upcoming VOICE Developer Conference happening virtually from June 21-23, 2021. VOICE is…

Learn about on-chip monitoring and analysis with Tessent Embedded Analytics SDK

Large and complex SoCs with embedded systems play a big role in the technology we depend on, from intelligent 5G…