A new way to solve systematic failures and boost yield

A novel approach from Siemens and PDF Solutions shows promise in speeding yield ramp on advanced nodes and solving yield…

The future of in-system testing for automotive safety

Suppliers of IP for automotive applications must ensure their IP blocks are ISO 26262 compliant. Siemens has the solutions for automotive safety and reliability.

Don’t Miss Silicon Lifecycle Solutions at U2U

Don’t miss the exciting lineup of Tessent Test and Embedded Analytics presentations at U2U North America on A[ril 13, 2023.

On-demand Webinar: Faster DFT, better results

Learn about faster DFT and better results using the bus-based packetized test of Tessent Streaming Scan Network.

Event: Tessent 2023 DFT Tech Forum

Attend the 2023 DFT Tech Forum to learn how Tessent silicon lifecycle solutions solve your complex SoC DFT challenges.

Webinar: How to implement DFT in 2.5/3D designs using Tessent Test software

Watch this on-demand webinar to learn about how the new Tessent Multi-die software automates the complex DFT tasks associated with 2.5D and 3D IC designs.

Message-based connections enable system-level debug and validation

Secure Message Infrastructure is a scalable, message-based on-chip communications fabric that facilitates system-level debug and validation by allowing configuration of on-chip Embedded Analytics IP, cross-triggering and data capture

DFT for tile-based design

How to master DFT for tile-based designs

Hierarchical designs that are tile-based or abutment based physical blocks are predominant in today’s chips. Having no logic present at the chip-level calls for new approaches to testing these tile-based architectures. How a design for test (DFT) architecture can support tile-based designs is the focus of this presentation from U2U 2022.

A new way of measuring heterogeneous SoC performance

Explore a new way to measure heterogenous SoC performance at the Linley Fall Processor Conference

Join Siemens at the Linley Fall Processor Conference, the two-day event focusing on processors and IP cores used in embedded, communications, automotive, IoT,
and server designs.